JPS6323272B2 - - Google Patents
Info
- Publication number
- JPS6323272B2 JPS6323272B2 JP18218880A JP18218880A JPS6323272B2 JP S6323272 B2 JPS6323272 B2 JP S6323272B2 JP 18218880 A JP18218880 A JP 18218880A JP 18218880 A JP18218880 A JP 18218880A JP S6323272 B2 JPS6323272 B2 JP S6323272B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- metal
- plating
- fluorine
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010408 film Substances 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 238000007747 plating Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 229910052731 fluorine Inorganic materials 0.000 claims description 13
- 239000011737 fluorine Substances 0.000 claims description 13
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 12
- 239000010409 thin film Substances 0.000 claims description 12
- 229920005672 polyolefin resin Polymers 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 8
- 238000007740 vapor deposition Methods 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000002033 PVDF binder Substances 0.000 description 6
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 239000000470 constituent Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 229920005597 polymer membrane Polymers 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OFHQVNFSKOBBGG-UHFFFAOYSA-N 1,2-difluoropropane Chemical compound CC(F)CF OFHQVNFSKOBBGG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- -1 ethylene, tetrafluoroethylene Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18218880A JPS57105425A (en) | 1980-12-22 | 1980-12-22 | Method for forming metallic film on fluorine-containing olefin resin molded article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18218880A JPS57105425A (en) | 1980-12-22 | 1980-12-22 | Method for forming metallic film on fluorine-containing olefin resin molded article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57105425A JPS57105425A (en) | 1982-06-30 |
| JPS6323272B2 true JPS6323272B2 (en]) | 1988-05-16 |
Family
ID=16113870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18218880A Granted JPS57105425A (en) | 1980-12-22 | 1980-12-22 | Method for forming metallic film on fluorine-containing olefin resin molded article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57105425A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0323089U (en]) * | 1989-07-18 | 1991-03-11 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3512342C2 (de) * | 1985-04-04 | 1993-12-23 | Daimler Benz Ag | Verfahren zur Metallisierung einer elektrisch isolierenden Oberfläche |
-
1980
- 1980-12-22 JP JP18218880A patent/JPS57105425A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0323089U (en]) * | 1989-07-18 | 1991-03-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57105425A (en) | 1982-06-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4560737A (en) | Piezoelectric polymeric material | |
| JPH02197183A (ja) | 積層圧電構造及びその形成方法 | |
| CN106813812A (zh) | 一种高压电活性柔性复合膜压电传感器及其制备方法 | |
| JPS63241193A (ja) | 表面処理を施した銅箔の製造方法 | |
| GB2090700A (en) | Piezoelectric flexure element and method of manufacture | |
| JPS606220B2 (ja) | ポリ弗化ビニリデンもしくは弗化ビニリデン共重合体の延伸薄膜製造法 | |
| CN104979467A (zh) | 一种复合结构机电换能材料的制备方法 | |
| JPS6323272B2 (en]) | ||
| US4356424A (en) | Pseudo-AC method of nonuniformly poling a body of polymeric piezoelectric material and flexure elements produced thereby | |
| US4692285A (en) | Process of preparing nonfibrous, piezoelectric polymer sheet of improved activity | |
| WO2020243396A1 (en) | Delamination processes and fabrication of thin film devices thereby | |
| JP3752861B2 (ja) | 含フッ素樹脂フィルムおよび積層体 | |
| JP3105645B2 (ja) | 圧電素子およびその製造方法 | |
| JPH0813900B2 (ja) | バイポーラ膜の製造方法 | |
| CN109338422B (zh) | Ipmc材料的制备方法、其中间体的制备方法、ipmc材料 | |
| Shi et al. | A flexible pressure sensor based on low-cost electroplated-Ni film induced cracking for wearable devices application | |
| JPS63195292A (ja) | 含フツ素オレフイン樹脂成形物に厚い金属皮膜を形成する方法 | |
| WO2000061365A1 (fr) | Materiau composite au titane | |
| US20060188728A1 (en) | Material for heat-resistant electret and heat-resistant electret | |
| JPS5963784A (ja) | 高分子圧電フイルムの製造方法 | |
| CN111575744A (zh) | 一种生长镍扣用阴极电解极板的制备方法 | |
| JPH05213000A (ja) | フッ素膜転写シート | |
| JP4279606B2 (ja) | フィルムめっき材料の製造方法及び製造装置 | |
| JPS635891B2 (en]) | ||
| JP2698995B2 (ja) | ポリマーｐｔｃ素子 |